HTC, Samsung deal with patent firm to steel vs. Apple, more
HTC today joined earlier sign-up Samsung in reaching a deal with Intellectual Ventures in a move meant to gird itself against patent lawsuits from rival smartphone makers. The agreements give both companies access to 30,000 patents and other intellectual property assets to "reduce [the] risk of litigation." Neither phone designer disclosed the terms, which for Samsung were reached last week....
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Orignal From: HTC, Samsung deal with patent firm to steel vs. Apple, more
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